采用磁脉冲辅助半固态钎焊(MPASSB)方法实现了铜/铝管连接，通过构建电磁-结构-流体多场耦合模型，系统分析了装夹成形与钎焊成形过程中管件的高速塑性变形及钎料剪切流变行为。通过调控装夹位置(0、10和15 mm分别记为H0、H10和H15),探究其对接头连接效果的影响。结果发现：随着装夹位置增高，装夹成形后铝管与钎料间的初始间隙逐渐增大；钎焊成形阶段，管件与钎料的动态相互作用是界面氧化层去除及冶金结合的关键机制。尽管H10及H15工况下的接头压应力及钎料流速均高于H0工况，但H10与H15工况下钎料与管件的传热效率较差，导致界面氧化层去除效果及接头冶金结合质量均明显劣于H0工况。实验结果表明，H0条件下工艺参数最优，其铜侧界面由Al_4.2Cu_3.2Zn_0.7和扩散层组成接头，未形成脆性金属间化合物。力学性能测试表明，接头剪切强度达76.4 MPa,断裂位置位于铜侧界面扩散层处。

Magnetic pulse-assisted semi-solid brazing(MPASSB) method was employed to achieve copper/aluminum tube connections. An electromagnetic-structural-fluid multi-physics coupling model was constructed to systematically analyze the high-speed plastic deformation of tubes and shear rheological behavior of filler metal during clamping and brazing forming processes. By adjusting the clamping position at 0 mm(H0), 10 mm(H10) and 15 mm(H15), the influence of this parameter on joint bonding quality was investigated. The results show that the initial gap between the aluminum tube and the filler metal after clamping forming gradually increases with the increase of clamping position. During brazing forming process, the dynamic interaction between tubes and filler metal is identified as the key mechanism for interface oxide layer removal and metallurgical bonding. Although H10 and H15 conditions exhibit higher joint compressive stress and filler metal flow velocity than H0 condition, their inferior heat transfer efficiency leads to significantly poorer oxide layer removal and metallurgical bonding. Experimental results confirm that H0 condition as the optimal parameter, the copper-side interface consists of Al_4.2Cu_3.2Zn_0.7 phase and the diffusion layer without brittle intermetallic compounds. The shear strength of joint achieves 76.4 MPa, with fracture occurring in the copper-side interfacial diffusion layer.