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作为应用于航天和精密电子设备散热的蒸气腔，其微结构的特征尺寸与形态对热传导效率具有关键作用。针对金属材料表面复杂微结构的成形难题，以工业纯铝1100为基材，通过利用DEFORM-3D模拟及分步压印工艺与常规一步压印工艺的对比实验，研究两种压印工艺成形中阵列阶梯状微通道的填充过程及应力-应变分布，分析微结构的成形机理及工艺参数对阵列结构填充完整性的调控规律。通过分步压印工艺第1步中成形三角形阵列微通道结构的过程，研究工艺参数对填充质量的影响，结果表明，对于阵列三角微通道的微压印成形，当成形温度为300℃、压印力达到21 kN、压印速度为0.01 mm·s-1、保压时间为360 s时，可获得最优的型腔填充效果。值得注意的是，由于分步压印工艺的台阶结构是同时成形的，因此应力应变更小且分布更加均匀，所以相对一步压印工艺需达到32 kN的压印力才能填充完成，在分步压印的二次成形阶段，仅需18 kN压印力即可实现台阶结构的完整成形，且填充完成度和表面质量均优于一步压印工艺成形的台阶结构。通过模拟和实验说明分步压印工艺在成形金属表面复杂阵列结构方面具有明显优势。
Abstract：As a vapor chamber used for heat dissipation of aerospace and precision electronic equipment, the characteristic size and shape of its micro structure play a key role in heat conduction efficiency. Aiming at the forming problem of complex micro structure on the surface of metal materials, taking industrial pure aluminum 1100 as the substrate, by using DEFORM-3D simulation and comparative experiments for step-by-step embossing process and conventional one-step embossing process, the filling process, as well as stress and strain distribution of array stepped micro channels in two embossing processes were studied, and the regulation laws of forming mechanism of micro structure and the process parameters on the filling integrity of array structure were analyzed. Through the process of forming a triangular array micro channel structure in the first step of the step-by-step embossing process, the influence of process parameters on the filling quality was studied. The results show that for the micro-embossing of the array triangular micro channel, when the forming temperature is 300 ℃, the embossing force reaches 21 kN, the embossing speed is 0.01 mm·s-1 and the holding time is 360 s, the optimal cavity filling effect can be obtained. It is worth noting that the step structure of the step-by-step embossing process is formed at the same time, so the stress and strain are small and the distribution is more uniform. Therefore, compared with the one-step embossing process, the embossing force of 32 kN is required to be filled completely. In the second forming stage of the step-by-step embossing process, only 18 kN embossing force is needed to realize the complete forming of the step structure, and the filling completion and surface quality are better than the step structure formed by the one-step embossing process. Simulations and experiments show that the step-by-step embossing process has obvious advantages in forming complex array structures on metal surfaces.
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基本信息:
中图分类号:TG306
引用信息:
[1]李昕儒,王晓亮,赵伊伊,等.铝合金阵列多尺度结构微热压印工艺[J].塑性工程学报,2026,33(08):87-96.
基金信息:
国家自然科学基金资助项目(52505361);国家自然科学基金资助项目(U24B2056); 中国博士后科学基金资助项目(2025M774308)
2026-08-21
2026-08-21
2026-08-21